Pioneering the frontiers of artificial intelligence computing with silicon carbide TOLL packaging

Wolfspeed's extensive portfolio of TOLL packaged silicon carbide MOSFETs provides excellent heat dissipation and greatly simplifies thermal management.

Figure 1: The C3M0025065L has a large metal strip on the back of the package and is designed with a separate driver source pin (source: Wolfspeed).

In recent years, the booming development of artificial intelligence (AI) has promoted new advances in chipset technology. Compared to traditional cpus, today's chipsets are more powerful and run more efficiently, but they also consume more power. The steep climb in power consumption has created a conundrum for system designers, who are struggling to design power supplies that can deliver more power in a smaller space while maintaining efficiency and reliability.

Wolfspeed's new C3M0025065L 25 mΩ Silicon Carbide MOSFET (Figure 1) provides the ideal solution to the power consumption challenges faced by modern server power supplies.

The C3M0025065L comes in a JEDEC-compliant TOL-Free package that is 25% smaller and 50% lower in height than comparable surface mount devices (SMDS) in packages such as the D2PAK. The smaller size can reduce thermal resistance by up to 20%, resulting in cost, space and weight advantages for the entire system. In addition, the inductance of the TOLL package is lower than other SMDS such as the D2PAK, as shown in Figure 2, and the back of the package has a larger metal sheet, so soldering to the PCB allows better heat dissipation.

Table 1 shows how an AI chipset can generate hundreds of watts of power consumption, and how the power provision requirements can be increased to more than 3.5 kW. In addition, these power supplies are required to comply with the Titanium 80+ standard, which requires that the input used by the power supply, whether 230 VAC or 115 VAC, achieve a minimum efficiency of 92% and 90%, respectively, at 50% and 100% load.

With the C3M0025065L, designers can use the totem pole PFC to achieve a minimum power factor of 0.95 and comply with Titanium 80+ standards. The topology uses two switches in a push-pull configuration, providing high efficiency and low EMI with zero reverse recovery current, low package inductance, and a wider input voltage range.

Table 1: Power consumption of top AI Gpus continues to climb.

Wolfspeed's extensive portfolio of TolL-packaged silicon carbide MOSFETs provides excellent heat dissipation and greatly simplifies thermal management, even under harsh conditions. The space-saving TOLL package enables a more compact and streamlined design and is one of the latest devices Wolfspeed continues to break the silicon Carbide device field work record of more than 10 trillion hours (and counting).